Micron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies NEWS HIGHLIGHTS 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity 1 than other NAND die in production. Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB
Read MoreAnnounces Collaborations with Ericsson*, Samsung*, Others as Part of Broad Effort Spanning Silicon, Devices, Security and Networking Solutions NEWS HIGHLIGHTS Introduces the Intel
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