Intel and Micron today unveiled 3D XPoint™ technology , the first new memory category in more than 25 years.
Read MoreMicron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies NEWS HIGHLIGHTS 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity 1 than other NAND die in production. Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB
Read MoreMicron and Intel today announced the availability of their 3D NAND technology , enabling SSDs the size of a stick of gum that can hold more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB. The companies used innovative techniques to stack layers of data storage cells vertically – in three dimensions – to deliver the world’s highest-density flash memory
Read More