Intel announced today plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” This collaboration is part of Intel’s strategy to integrate re programmable technology with Intel® Xeon® processors to provide cloud customers with custom solutions that greatly improve performance, power and cost.
Read MoreCompanies Plan to Deliver Custom Intel® Xeon® Processors with eASIC Platforms to Speed Workloads like Security, Big Data, and Other Applications SANTA CLARA, Calif., May 12, 2015 – Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud.” The new parts will enable acceleration of up to two times that of a field programmable gate array (FPGA) for workloads like security and big data analytics while also speeding the time to market for custom application specific integrated circuit (ASIC) development by as much as 50 percent 1 . The tremendous growth of cloud computing has spurred greater demand for customized chips that make a particular application or workload run faster.
Read More1,700 High School Students Compete for Approximately US$4M in Pittsburgh WHAT: The Intel International Science and Engineering Fair , a program of Society for Science & the Public and the world’s largest high school science research competition, will take place in Pittsburgh from May 10-15. Approximately 1,700 high school students selected from 422 affiliate fairs in more than 75 countries, regions and territories will showcase cutting – edge research and inventions and compete for approximately US$4 million in awards. The full list of finalists is available in the event program (starting on page 61).
Read MoreIntel today announced the winners of the $1 million Intel RealSense App Challenge , an international competition that highlights user experience innovation with Intel RealSense technology. Brazilian developer Alexandre Ribeiro da Silva of Anima Games won the $100,000 Grand Prize for the Ambassador track for its gaming app “Seed,” while the $50,000 Grand Prize winner for the Pioneer track was awarded to Canadian developer David Schnare of Kinetisense for “OrthoSense,” an app for medical professionals to remotely monitor patient rehabilitation. Over 7,000 developers across 37 countries participated in the challenge.
Read MoreWHAT: Maker Faire Bay Area Intel is the presenting sponsor of the 10th annual Maker Faire.
Read MoreIn order to better help consumers protect their digital lives, Intel Security is leading an effort on World Password Day to help educate consumers globally on the importance of password safety.
Read MoreCloudera CEO Tom Reilly joined Diane Bryant, Intel Senior Vice President and General Manager of Intel’s Data Center Group, on stage at Intel’s May 5 Analytics Day to discuss the one-year anniversary of Intel’s investment in Cloudera. View the replays of the Intel and Cloudera keynotes from Intel’s “Analytics Day” event yesterday in San Francisco
Read MoreVending-Specific Gateway, N&W Global Vending Collaboration Announced NEWS HIGHLIGHTS Intel today announced the Intel® IoT Retail Gateway Reference Design for Intelligent Vending, an integrated, pre-validated and flexible design which includes including hardware, software and security building blocks to speed up development and deployment of smart vending machines. N&W Global Vending* will be at the Intel booth at the VendItalia 2015 International Vending Exhibition in Milan, offering a sneak preview of the first prototype of a vending machine based on the latest Intel technologies
Read MoreVending-Specific Gateway, N&W Global Vending Collaboration Announced NEWS HIGHLIGHTS Intel today announced the Intel® IoT Retail Gateway Reference Design for Intelligent Vending, an integrated, pre-validated and flexible design which includes including hardware, software and security building blocks to speed up development and deployment of smart vending machines. N&W Global Vending* will be at the Intel booth at the VendItalia 2015 International Vending Exhibition in Milan, offering a sneak preview of the first prototype of a vending machine based on the latest Intel technologies. Now available from Intel® Internet of Things Solutions Alliance members, including Advantech*, Gigabyte* and Jabil*.
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