1-866-MSP-9666 (866-677-9666) | sales@mspdata.com

idf

Tag Archives

Chip Shot: Driving 5G Innovation from Device to Data Center

During a session focused on 5G at the Intel Developer Forum in San Francisco today, Intel introduced the Intel Network Builders Fast Track – a program comprised of market development activities and Intel Capital investments – designed to accelerate network innovation and interoperability. Intel executives Aicha Evans and Sandra Rivera joined Dr


Chip Shot: Intel Unveils Intel® Optane™ Technology Based on 3D XPoint™

At the Intel Developer Forum, the company announced that Intel® Optane™ technology will combine the revolutionary 3D XPointTM non-volatile memory media with the company’s advanced system memory controller, interface hardware and software IP, to unleash vast performance potential in a range of forthcoming products. Beginning in 2016, Intel Optane technology will come to market in a new line of high-endurance, high-performance SSDs. The new technology will also power a new line of Intel DIMMs designed for Intel’s next-generation data center platforms.


Chip Shot: The "Game"-Changer session at IDF

During the “Game”-Changer session today at the Intel Developer Forum 2015 , Doug Fisher , senior vice president and general manager of the Software and Services Group and Kirk Skaugen , senior vice president and general manager of the Client Computing Group talked about how computing has always been at the heart of the gaming industry and the PC remains the number one platform for gaming.


Chip Shot: Intel® RealSense™ Technology at IDF 2015

During his opening address at the Intel Developer Forum (IDF) , CEO Brian Krzanich talked about his vision of Intel® RealSense™ technology everywhere. He talked about Intel’s collaboration with Google in driving innovation in mobile depth sensing by combining Project Tango and Intel RealSense technologies into an Android Smartphone developer kit, which will be available to developers through a pilot program by the end of this year. He also announced that, in addition to Windows and Android, developers will also be able to use Intel RealSense technology on platforms including Mac OS X, ROS, Linux, Scratch, Unity, XSplit, OBS, Structure SDK, OSVR and Unreal Engine 4


Chip Shot: 1 Million Prize to be Awarded to the Top Inventor in New "America’s Greatest Makers" Reality Competition

At the 2015 Intel Developer Forum in San Francisco, CA, United Artists Media Group CEO Mark Burnett and Intel CEO Brian Krzanich, announced ” America’s Greatest Makers ,” a new reality competition premiering in the first half of 2016 across the Turner Broadcasting entertainment platform that builds off the success of last year’s Intel ‘Make it Wearable’ challenge. Offering a $1 million prize, the challenge showcases makers inventing wearables and smart connected consumer devices powered by Intel® Curie™ technology.


Intel Expands Developer Opportunities as Computing Expands Across All Areas of Peoples’ Lives

Intel® RealSense™ Technology Extends to New Platforms and Devices ‘America’s Greatest Makers’ Reality Competition to Premier in 2016 3D XPoint™ Comes to Storage and Memory Solutions with Intel® Optane™ Technology INTEL DEVELOPER FORUM, San Francisco, Aug. 18, 2015 – In the opening address at the Intel Developer Forum (IDF), CEO Brian Krzanich highlighted new products, tools and programs that support the growing personalization of computing and described the trends creating new opportunities for developers across an unprecedented breadth of technologies.


Chip Shot: Intel® Thunderbolt™ 3 Controller Achieves USB 3.1 Certification

Intel is excited to announce the Intel® Thunderbolt™ 3 controller is one of the first controllers to achieve USB 3.1 certification by the USB-IF compliance program. Thunderbolt 3 controllers can provide two separate ports with USB 3.1 support and dedicated bandwidth of 10 Gbps each, providing more bandwidth than other USB controllers


Intel Marks 30 Years in China with New Products, Investments and Collaborations

Intel Extends Intel® Atom™ x3 Processor Roadmap to Internet of Things; Unveils Intel Mass Makerspace Accelerator Program to Drive Global Innovation, Entrepreneurship INTEL DEVELOPER FORUM, Shenzhen, China, April 8, 2015 – As Intel Corporation celebrates 30 years of local and global technology innovation this year with China, Intel CEO Brian Krzanich today announced additional investments and collaborations that promise to deliver value across a range of industries for the smart, connected world for years to come.


Categories