Intel announced plans to increase its investment in non-volatile memory technology to better serve customer needs and keep pace with the strong demand for Intel® Solid State Drive solutions.
Read MoreIntel® RealSense™ Technology Extends to New Platforms and Devices ‘America’s Greatest Makers’ Reality Competition to Premier in 2016 3D XPoint™ Comes to Storage and Memory Solutions with Intel® Optane™ Technology INTEL DEVELOPER FORUM, San Francisco, Aug. 18, 2015 – In the opening address at the Intel Developer Forum (IDF), CEO Brian Krzanich highlighted new products, tools and programs that support the growing personalization of computing and described the trends creating new opportunities for developers across an unprecedented breadth of technologies.
Read MoreIntel and Micron today unveiled 3D XPoint™ technology , the first new memory category in more than 25 years.
Read MoreNew Class of Memory Unleashes the Performance of PCs, Data Centers and More NEWS HIGHLIGHTS Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years. New 3D XPoint™ technology brings non-volatile memory speeds up to 1,000 times faster 1 than NAND, the most popular non-volatile memory in the marketplace today.
Read MoreComputing Innovation, New Experiences and Internet of Things Solutions to Create Smart and Connected World 5th Gen Intel® Core™ mobile processor (“Broadwell-H”) 5th Gen Intel® Core™ desktop processor (“Broadwell-H”) Intel Unite enables smart and connected meeting spaces with enhanced security COMPUTEX, Taipei, Taiwan, June 2, 2015 – Intel Corporation today announced products and solutions that will deliver new user experiences and support the computing ecosystem’s expansion into new areas. During the opening keynote address at Computex 2015, Kirk Skaugen, senior vice president and general manager of Intel’s Client Computing Group encouraged the Taiwan ecosystem to work together and capture the opportunity to shape the future of computing
Read MoreMicron and Intel Unveil New 3D NAND Flash Memory Technology Advancements Enable Three Times More Capacity than Other NAND Technologies NEWS HIGHLIGHTS 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity 1 than other NAND die in production. Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB
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