scalable-system

Chip Shot: Intel Unveils New Details for Upcoming Intel® Omni-Path Architecture

Today at HotInterconnects 2015 , Intel provided new details for its future Intel® Omni-Path Architecture (Intel® OPA), a next-generation high performance computing (HPC)-optimized fabric technology and a key component of Intel’s HPC scalable system framework. Intel OPA is designed for the integration of fabric components with CPU and memory to reduce latency, increase node bandwidth and enable the lower power, higher density systems required by next-generation data centers

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April 9, 2015
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180 Petaflops System Based on Intel’s HPC Scalable System Framework to Advance Scientific Research and Discovery Intel Selected by U.S. Department of Energy to Deliver Nation’s Most Powerful Supercomputer SANTA CLARA, Calif., April 9, 2015 – Intel Corporation today announced that the U.S.

Chip Shot: Intel Unveils New Details for Upcoming Intel® Omni-Path Architecture

U.S. Department of Energy Selects Intel to Deliver Nation’s Most Powerful Supercomputer at Argonne National Laboratory